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Product image / FCCL-HK-1, FCCL-HK-2 Polyimide product
FCCL-HK-1, FCCL-HK-2
Polyimide Flexible Copper Clad Laminate (FCCL)
Excellent high-temperature resistance, peel strength, and low CTE, with high transmittance and low haze after etching.
Request product informationProduct characteristics
Key product characteristics
Low CTE
High transmittance and low haze after etching
Applications
Material performance, translated into real applications
From technical data to end applications, choose the polyimide material that fits your process and performance targets.
01Flexible circuits
02Flexible transparent display
Technical specifications
Polyimide Flexible Copper Clad Laminate (FCCL) technical data
Values are measured by HUAKE Method or the corresponding standard shown.
| Parameter | Unit | FCCL-HK-1 | FCCL-HK-2 | Test method |
|---|---|---|---|---|
| Appearance | - | 表面光滑、无折痕、无指纹 | 表面光滑、无折痕、无指纹 | - |
| Base film thickness | μm | 50±2 | 50±2 | ASTM D374 |
| Copper layer thickness | μm | 18±2 | 18±2 | HUAKE Method |
| Tensile strength | MPa | ＞190 | ＞160 | ASTM D882 |
| Elongation | % | 25-30 | 40-45 | ASTM D882 |
| Peel strength | N/cm | ＞0.7 | ＞1.0 | HUAKE Method |
| Tg | ℃ | 355-365 | 290-300 | HUAKE Method |
| Thermal shrinkage | % | ±0.1 | ±0.5 | ASTM D2305 |
| Transmittance after etching | % | ＞89 | ＞88 | ASTM D1003 |
| b* value after etching | - | ≤2.7 | ≤2.0 | HUAKE Method |
| Haze after etching | - | ≤2.2 | ≤1.4 | HUAKE Method |
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