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Product image / A-HK-1, A-HK-2 Polyimide product
A-HK-1, A-HK-2
Polyimide Adhesive
Excellent mechanical, bonding, high-temperature, and chemical resistance with low CTE.
Request product informationProduct characteristics
Key product characteristics
High-temperature and chemical resistance
Low CTE
Applications
Material performance, translated into real applications
From technical data to end applications, choose the polyimide material that fits your process and performance targets.
01High-temperature bonding
02Screen printing
Technical specifications
Polyimide Adhesive technical data
Values are measured by HUAKE Method or the corresponding standard shown.
| Parameter | Unit | A-HK-1 | A-HK-2 | Test method |
|---|---|---|---|---|
| Appearance | - | 表面平整，无褶皱、气泡、胶粒、杂质、划痕 | 表面平整，无褶皱、气泡、胶粒、杂质、划痕 | - |
| PI film thickness | μm | 50±2 | 50±2 | ASTM D374 |
| Adhesive layer thickness | μm | 3±0.5 | 3±0.5 | ASTM D374 |
| Tensile strength | MPa | ＞90 | ＞130 | ASTM D882 |
| Elongation | % | 45-50 | 30-35 | ASTM D882 |
| Peel strength | N/cm | ＞0.9 | ＞1.1 | HUAKE Method |
| Temperature resistance | ℃ | ＞290 | ＞320 | HUAKE Method |
| Lamination temperature | ℃ | 170 | 180 | HUAKE Method |
| Thermal shrinkage | % | ±0.25 | ±0.4 | ASTM D2305 |
| Dielectric strength (PI layer) | kV | ＞6.3 | ＞4.6 | ASTM D149 |
| Volume resistivity (PI layer) | Ω·m | ＞10¹⁴ | ＞10¹⁴ | ASTM D257 |
| Surface resistivity (PI layer) | Ω | ＞10¹⁴ | ＞10¹⁴ | ASTM D257 |
| Resistance to 2M NaOH | - | OK | OK | HUAKE Method |
| Resistance to 2M HCl | - | OK | OK | HUAKE Method |
| Resistance to IPA | - | OK | OK | HUAKE Method |
| Resistance to MEK | - | OK | OK | HUAKE Method |
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