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Product image / CPI-HK-1, CPI-HK-4 Polyimide product
CPI-HK-1, CPI-HK-4
Colorless Transparent Polyimide Film
Excellent optical and mechanical performance, high-temperature resistance, low CTE, and low yellowness for flexible substrates.
Request product informationProduct characteristics
Key product characteristics
High-temperature resistance and low CTE
Low yellowness for flexible substrates
Applications
Material performance, translated into real applications
From technical data to end applications, choose the polyimide material that fits your process and performance targets.
01Flexible transparent display substrates
02Flexible electronic devices
03Solar cells
04Aerospace and marine observation windows
Technical specifications
Colorless Transparent Polyimide Film technical data
Values are measured by HUAKE Method or the corresponding standard shown.
| Parameter | Unit | CPI-HK-1 | CPI-HK-4 | Test method |
|---|---|---|---|---|
| Appearance | - | 表面平整，无色透明，无褶皱、气泡、胶粒、杂质、划痕 | 表面平整，无色透明，无褶皱、气泡、胶粒、杂质、划痕 | - |
| Thickness | μm | 50±2 | 50±2 | ASTM D374 |
| Water absorption | % | ＜2 | ＜2 | ASTM D570 |
| Tensile strength | MPa | ＞190 | ＞242 | ASTM D882 |
| Elongation | % | 25-30 | 40-45 | ASTM D882 |
| Elastic modulus | GPa | ＞5.5 | ＞5.2 | ASTM D882 |
| Peel strength | N/cm | ＞0.6 | ＞0.4 | HUAKE Method |
| Tg | ℃ | 355-365 | 380-390 | HUAKE Method |
| CTE (50-250℃) | ppm/℃ | ≤12 | ≤20 | ASTM D696 |
| Thermal decomposition temperature @Td5% | ℃ | ＞450 | ＞500 | GB/T 23987-2009 |
| Flame retardancy | - | UL 94 V-0 | UL 94 V-0 | GB/T2408-2021 |
| T550nm | % | ＞91 | ＞89 | ASTM D1003 |
| b* value | - | ≤0.7 | ≤1.2 | HUAKE Method |
| Haze | - | ≤1 | ≤0.7 | HUAKE Method |
| UV cut-off wavelength | nm | ≤370 | ≤380 | HUAKE Method |
| Dielectric strength | kV | ＞5.4 | ＞5.3 | ASTM D149 |
| Dielectric constant | - | ＜2.1 | ＜2.8 | ASTM D150 |
| Volume resistivity | Ω·m | ＞10¹⁶ | ＞10¹⁴ | ASTM D257 |
| Surface resistivity | Ω | ＞10¹⁶ | ＞10¹⁶ | ASTM D257 |
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